K230
- Overview
- Function Diagram
- Device Parameter
- Application Scenario
- SDK List
- Document
- Download
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K230
The K230 chip is an end-side AIoT (Artificial Intelligence of Things) chip based on the RISC-V architecture. It features high precision, low latency, high performance, ultra-low power consumption, and fast boot-up, making it widely applicable to various intelligent product scenarios such as edge-side large model multimodal access terminals, 3D structured light depth perception modules, interactive robots, open-source hardware, smart manufacturing, smart homes, smart education hardware, and many other fields.
Function Diagram
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Device Parameter
CPU
- CPU 1: RISC-V processor, 1.6GHz, 32KB I-cache, 32KB D-cache, 256KB L2 Cache, 128-bit RVV 1.0 extension
- CPU 0: RISC-V processor, 0.8GHz, 32KB I-cache, 32KB D-cache, 128KB L2 Cache
KPU
- Supports INT8 and INT16
- Typical network performance: Resnet 50 ≥ 85fps @INT8; Mobilenet_v2 ≥ 670fps @INT8; YoloV5S ≥ 38fps @INT8
DPU
- 3D structured light depth engine, supporting a maximum resolution of 1920*1080
VPU
- H.264 and H.265 encoder and decoder with a maximum resolution support of 4096*4096
- Encoder performance: 3840*2160@20fps
- Decoder performance: 3840*2160@40fps
- JPEG codec: supports up to 8K (8192*8192) resolution
Image Input
- Supports up to three lanes MIPI CSI (1x4lane + 1x2lane) or 3x2lane
Display Output
- 1 lane MIPI DSI, 1x4 lane or 1x2 lane
- Maximum resolution 1920*1080@60fps
On-chip Interfaces
- 5 x UART
- 5 x I2C
- 6 x PWM
- 64 x GPIO + 8 x PMU GPIO
- 2 x USB 2.0 OTG
- 2 x SDxC: SD3.01, eMMC 5.0
- 3 x SPI: 1 x OSPI + 2 x QSPI
- WDT / RTC / Timer
Application Scenario
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Assisted Driving
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Smart Network Camera
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Robot Interaction
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Unmanned Aerial Vehicle
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Face access control
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Industrial Camera
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Smart Power Equipment
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STEAM Education
SDK List
----Choose the best fit from four software options and click to view the guide.----
Document
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